It is compatible
with solder paste printed SMD diode、audion、optocoupler tube and mobile-phone
backlight etc.
Product Features
1.International leading double die bond and double die searching system;
2.Linear motor is applied to drive bond head;
3.Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
4.Crystal frame automatic correction chip structure is also applied
5.Vacuum die missing testing technology is adopted;
6.Automatic loading and unloading system is applied to saving the time of
reloading;
7.Automatic installing & uninstalling
crystal rings is applied to improve the production efficiency largely;
8.IPC will control the operation of equipment, simplifying the operation of
automation equipment;
9.Sophisticated equipment will help improve your enterprise’s production
efficiency and reduce relevant costs so as to provide effective guarantee and
enhance the enterprise’s competitiveness;
10.Precise die bond location and
excellent compatibility will guarantee the back-end processing.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
65ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
吸晶摆臂/Swing Arm of Die Bonder
双摆臂120°可旋转固晶(Rotatable Die Bond with Double Swing Arms)
XY位置精度/Accuracy (带芯片校正功能/ With Die Correcting Feature)
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