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HAD308
Plane-type High-speed Die Bonder
Cycle: 80ms
It is compatible with SMD、COB 、diode、audion、flip-chip etc.
Product Features
1. International leading double die bond, double adhesive dispensing and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Crystal frame automatic correction chip structure is also applied
5. Programmed control constant-temperature adhesive dispensing system is also applied;
6. Vacuum die missing testing technology is adopted;
7. Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency;
8. IPC will control the operation of equipment, simplifying the operation of automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
80ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
吸晶摆臂/Swing Arm of Die Bonder
90°可旋转固晶(Rotatable Die Bond)
XY位置精度/Accuracy
±1mil(±0.025mm）
吸晶压力/Die Bond Pressure
可调20g—250g(Adjustable)
芯片旋转/Die Rotation
±1°
5.送料工作平台/Loading Workbench
2.芯片XY工作台/Die XY Workbench
行程范围/Range of Stroke
300mm*75mm
芯片尺寸/Die Dimensions
5mil×5mil-80mil×80mil
XY分辨率/XY Resolution
0.02mil（0.5μm）
6.适用支架尺寸/Suitable Holder’s Size
晶片最大角度修正/Max. Angle Correction
±15°
支架长度/Length
145mm ~ 300mm
最大芯片环尺寸/Max. Die Ring Size
8″（210mm）外径 铁环(External Diameter) Iron
Ring
支架宽度/Width
40mm~ 75mm
最大芯片面积尺寸/Max. Die Area
6.5″（165mm）扩张后(Expanded)
7.所需设施/Facilities Needed
分辨率/Resolution Ratio
0.04mil (1μm)
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
顶针Z高度行程/Thimble Z Height Stroke
80mil（2mm）
压缩空气/Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
950W
3.图像识别系统/Image Recognition System
耗气量/Gas Consumption
5L/min
灰阶度/Grey Scale
256级灰度(Level Grey)
8.体积及重量/Volume and Weight
分辨率/Resolution
656 x 492像素(Pixels)
长x宽x高/Length x Width x Height
175 x125 x185cm
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
重量/Weight
1470kg
(0.13mm*0.13mm-2mm*2mm)
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