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HAD810
Automatic Plane-type Die Bonder
Cycle: 220ms
It is compatible with IC frame
1. Linear motor is applied to drive double adhesive dispensing bond head;
2. High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;
3. High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;
4. A separate dispensing control system is adopted to make a precisely control of dispensing amount;
5. Vacuum die missing testing technology is adopted;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
220ms（取决于芯片与支架）(Depending On Die Size And Holder)
吸晶摆臂
/Die Bonder’s Swing Arm
150mm 直线电机往复固/linear motor reciprocate die bonding
XY位置精度/Accuracy
±0.6mil(±0.015mm）
吸晶压力
/Die Bond Pressure
可调20g—250g(Adjustable)
不作上视式检查Accuracy (Up-look inspection)
±1mil（±0.025mm）
5.适用支架尺寸/Suitable Holder’s Size
芯片旋转/Die Rotation
±1°
2.芯片XY工作台/Die XY Workbench
支架长度/Length
110mm ~ 280mm
芯片尺寸/Die Dimensions
5mil×5mil-100mil×100mil
小于12mil芯片需考虑胶杯沾胶
(Consider the glue disk dispensing way if the die is lesser than 12mil)
支架宽度/Width
25mm ~ 110mm
晶片最大角度修正/
Max. Angle Correction
360°
6.所需设施/Facilities Needed
适用芯片环尺寸/
Max. Die Ring Size
外径(External Diameter):296mm 内径(Inner Diameter)：254mm
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
最大芯片面积尺寸
/Max. Die Area
直径205mm（扩张后）(Expanded)
压缩空气/Compressed Air
0.5MPa（MIN）
分辨率/Resolution Ratio
0.04mil (1μm)
额定功率/Rated Power
1820W
顶针Z高度行程/Thimble Z Height
Stroke
80mil（2mm）
耗气量/Gas Consumption
5L/min
适用铁环/晶圆
Suitable Iron ring/ wafer
标配 10寸铁环8寸晶圆/Standard Equipped with 10″Iron Ring and 8″Wafer
可兼容 8寸铁环6寸晶圆/Compatible with 8″Iron Ring and 6″Wafer
3.图像识别系统/Image Recognition System
适用针筒规格
Suitable Barrel Spec.
标配10CC(可兼容5CC和3CC) /Standard Equipped with 10CC, (Compatible with 5CCand
3CC)
灰阶度/Grey Scale
256级灰度(Level Grey)
7.体积及重量/Volume and Weight
分辨率/Resolution
656×492像素(Pixels)
长x宽x高/
Length x Width x Height
205×135×190cm
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
重量/Weight
1800kg
(0.13mm*0.13mm-2.54mm*2.54mm)
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