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HAD826P
    發布時間: 2019-07-23 15:59    


HAD826P(平面式高速固晶機)

(週期:140ms

適用於倒裝、COBSMD352821215050等各類支架

一、機型特性

1.平面式LED燈全自動固晶的最佳選擇;

2.高速固晶(140ms/顆,每小時產量為25K)、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

3.精准的固晶位置及優良的一致性為後道工序提供了先天的保障;

4.吸抓一體和料盒推支架兩種方式相容進料,可迴圈式料盒收料;同時採用左進料和右收料的方式,方便操作人員操作機台;


6.採用全新接觸式深測系統控制擺臂;

7.線性電機驅動晶片搜尋平臺(X/Y)與固晶平臺(B/C

8.採用可程式恒溫點膠系統;

9.採用真空漏晶檢測;

10. 工控機控制設備運行,簡化了自動化設備的操作;

 

HAD826P

Plane-type High-speed Die Bonder

Cycle: 140ms

It is compatible with flip-chipCOBSMD35282121 and 5050 etc. types of holders

 

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(140ms/ piece, 25K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Two ways of suction and grasping united and the magazine push holders are compatible to load, and receiving by the circulating magazine; meanwhile, the left loading and right receiving method made it convenient to operate;

5.        Linear motor is applied to drive bond head;

6.   New deep contact measurement system control arm is applied;

7.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

8.        Brand-new constant-temperature adhesive dispensing system is also applied;

9.        Vacuum die missing testing technology is adopted;

10.    IPC will control the operation of equipment, simplifying the usage of automation equipment.

 

二、規格參數

Specifications and Parameters

 

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

140ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

90°可旋轉固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±3°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

支架長/Length130mm-260mm.

支架寬/Width50mm-130mm.

晶片尺寸

/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY解析度/XY Resolution

0.02mil0.5μm

最大晶片環尺寸/Max. Die Ring Size

6″(152mm)外徑(External Diameter)

6.所需設施/Facilities Needed

最大晶片面積尺寸/Max. Die Area

4.7″(119mm)擴張後(Expanded)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

解析度/Resolution Ratio

0.04mil  (1μm)

壓縮空氣/Compressed Air

0.5MPaMIN

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

額定功率/Rated Power

700W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

7.體積及重量/Volume and Weight

解析度/Resolution

656×492圖元(Pixels)

xx/

Length x Width x Height

140×97×180cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/eight

874kg

 


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