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HAD300A-R, HAD300A-L
（三頭平面式高速固晶機）
（單頭週期：170ms）
適用於SMD020、1010、2121,3014及2835,5050等
一、機型特性
1.採用國際領先的三固晶，三點膠，三晶片搜尋系統；
2.採用直驅電機驅動邦頭
3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）
4.採用可程式恒溫點膠系統；
5.採用真空漏晶檢測；
6.採用自動式上下料，減少換料時間；
7. 工控機控制設備運行，簡化了自動化設備的操作；
8.精准的設備化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
9. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障，同時固晶位置精準確保LED燈光斑的品質，良好焊接及漂亮光斑再加上優良晶片就構成了高品質LED產品；
10. GS300A-R 是右進料左出料， GS300A-L 是左進料右出料。
HAD300A-R, HAD300A-L
Triple-head Plane-type High-speed Die Bonder
Single Head Cycle: 170ms
It is compatible with SMD020、1010、 2121、3014、2835 and 5050 etc.
Product Features
1. International leading triple die bond, triple adhesive dispensing and triple die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature double adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system is applied to saving the time of reloading;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;
10. GS300A-R is right loading and left unloading, the GS300A-L is left loading and right unloading.
二、規格參數
Specifications and Parameters
1.系統功能/System Function
4、吸晶擺臂機械手系統/
Die Bonder’s Swing Arm-and-hand system
生產週期/Production Cycle
170ms（取決於晶片尺寸及支架(Depending
On Die Size And Holder)
吸晶擺臂/Swing Arm of Die Bonder
360°可旋轉固晶 (Rotatable Die Bond)
XY位置精度/Accuracy
±1.0mil(±0.025mm）
吸晶壓力/Die Bond Pressure
可調20g—250g(Adjustable)
晶片旋轉/Die Rotation
±3°
5.送料工作平臺/Loading
Workbench
2.晶片XY工作臺/Die XY
Workbench
行程範圍/Range of Stroke
170mm*75mm
晶片尺寸/Die Dimensions
5mil×5mil-80mil×80mil
XY解析度/XY Resolution
0.02mil（0.5μm）
6.適用支架尺寸/Suitable
Holder’s Size
晶片最大角度修正/Max. Angle Correction
±30°
支架長度/Length
80-170mm
最大晶片環尺寸/Max. Die Ring Size
6″（152mm）外徑(External
Diameter)
支架寬度/Width
45-75mm
最大晶片面積尺寸/Max. Die Area
4.7″（119mm）擴張後(Expanded)
7.所需設施/Facilities
Needed
解析度/Resolution Ratio
0.04mil (1μm)
電壓/頻率/Voltage/Frequency
220V AC±5%/50HZ
頂針Z高度行程/Thimble Z Height Stroke
80mil（2mm）
壓縮空氣/Compressed Air
0.5MPa（MIN）
額定功率/Rated Power
1300W
3.圖像識別系統/Image
Recognition System
耗氣量/Gas Consumption
5L/min
灰階度/Grey Scale
256級灰度(Level Grey)
8.體積及重量/Volume
and Weight
解析度/Resolution
656×492圖元(Pixels)
長x寬x高/Length x Width x Height
249×93×195cm
圖像識別精准度/Image Recognition Accuracy
±0.025mil@50mil觀測範圍(Observation
Range)
重量/Weight
1700kg
(0.13mm*0.13mm-2mm*2mm)
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