HAD826HD

平面式高速固晶機

（週期：200ms）

適用於倒裝、COB、軟燈絲條）等各類支架

一、機型特性

1.平面式LED燈全自動固晶的最佳選擇；

2.高速固晶（200ms/顆，每小時產量為16K）、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

3.精准的固晶位置及優良的一致性為後道工序提供了先天的保障，同時固晶位置精準確保LED燈光斑的品質，良好焊接及漂亮光斑再加上優良晶片就構成了高品質LED產品；

4.吸料方式進料，同時採用左進料和右收料的方式，方便操作人員操作機台；

5.採用直驅電機驅動邦頭；

6.採用全新接觸式深測系統控制擺臂；有效解決了PCB板或支架高度不一致而導致的固晶問題

7.線性電機驅動晶片搜尋平臺（X/Y）與固晶平臺（B/C）

8.採用可程式雙點膠頭恒溫點膠系統；

9.採用真空漏晶檢測；

10.工控機控制設備運行，簡化了自動化設備的操作；

 

HAD826HD

Plane-type High-speed Die Bonder

Cycle: 200ms

It is compatible with flip-chip、COB、soft filament etc. types of holders

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(200ms/piece, 16K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;

4.        Suction receiving way with the left loading and right receiving method made it convenient to operate;

5.        Linear motor is applied to drive bond head;

6.        New deep contact measurement system control arm is applied; solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

7.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

8.        Programmed control constant-temperature double adhesive dispensing system is also applied;

9.        Vacuum die missing testing technology is adopted;

10.    IPC will control the operation of equipment, simplifying the operation of automation equipment.

二、規格參數

Specifications and Parameters

 

1.系統功能/System Function		4、吸晶擺臂機械手系統/ Die Bonder’s Swing Arm-and-hand system
生產週期/Production Cycle	200ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder)	吸晶擺臂/Swing Arm of Die Bonder	90°可旋轉固晶(Rotatable Die Bond)
XY位置精度/Accuracy	±1.5mil(±0.038mm）	吸晶壓力/Die Bond Pressure	可調20g—250g(Adjustable)
晶片旋轉/Die Rotation	±3°	5.送料工作平臺/Loading Workbench
2.晶片XY工作臺/Die XY Workbench		行程範圍/Range of Stroke	支架長/Length：130mm-620mm. 支架寬/Width：30mm-73mm（每一款支架需定制一款底板）A customized  substrate is needed to  each type of holder
晶片尺寸/Die Dimensions	5mil×5mil-80mil×80mil (0.13mm*0.13mm-2mm*2mm)	XY解析度/XY Resolution	0.02mil（0.5μm）
最大晶片環尺寸 /Max. Die Ring Size	6″（152mm）外徑(External Diameter)	6.所需設施/Facilities Needed
最大晶片面積尺寸/Max. Die Area	4.7″（119mm）擴張後(Expanded)	電壓/頻率/Voltage/Frequency	220V AC±5%/50HZ
解析度/Resolution Ratio	0.04mil  (1μm)	壓縮空氣/Compressed Air	0.5MPa（MIN）
頂針Z高度行程/Thimble Z Height Stroke	80mil（2mm）	額定功率/Rated Power	700W
3.圖像識別系統/Image Recognition System		耗氣量/Gas Consumption	5L/min
灰階度/Grey Scale	256級灰度(Level Grey)	7.體積及重量/Volume and Weight
解析度/Resolution	512×512圖元(Pixels)	長x寬x高/ Length x Width x Height	1965×1185×1740mm
圖像識別精准度/Image Recognition Accuracy	±0.025mil@50mil觀測範圍(Observation Range)	重量/Weight	1060kg