GT100BH-PA
Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.
一、Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Crystal frame automatic correction chip structure is also applied;
5. Programmed control constant-temperature adhesive dispensing system is also applied;
6. Vacuum die missing testing technology is adopted;
7. Automatic loading and unloading system is applied to saving the time of reloading;
8. Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;
9. IPC will control the operation of equipment, simplifying the operation of automation equipment;
10. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
11. Precise die bond location and excellent compatibility will guarantee the back-end processing.
二、Specifications and Parameters
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1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
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生产周期/Production Cycle |
50ms 周期取决于晶片尺寸及支架(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
90°可旋转固晶(Rotatable Die Bond) |
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XY位置精度/Accuracy |
±1mil(±0.025mm） |
吸晶压力/Die Bond Pressure |
可调20g—250g(Adjustable) |
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芯片旋转/Die Rotation |
±1° |
5.送料工作平台/Loading Workbench |
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2.芯片XY工作台/Die XY Workbench |
行程范围/Range of Stroke |
170mm*75mm |
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芯片尺寸/Die Dimensions |
3mil×3mil-80mil×80mil |
XY分辨率/XY Resolution |
0.02mil(0.5μm) |
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6.适用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正/Max. Angle Correction |
±15° |
支架长度/Length |
120mm ~ 170mm（低于120-80需定制）(Need customize if lower than 120-80mm) |
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最大芯片环尺寸/Max. Die Ring Size |
6″（152mm）外径(External Diameter) |
支架宽度/Width |
40mm~ 75mm（低于40-30需定制）(Need customize if lower than 40-30mm) |
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最大芯片面积尺寸/Max. Die Area |
4.7″（119mm）扩张后(Expanded) |
7.所需设施/Facilities Needed |
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分辨率/Resolution Ratio |
0.04mil (1μm) |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
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压缩空气/Compressed Air |
0.5MPa（MIN） |
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顶针Z高度行程/Thimble Z Height Stroke |
80mil（2mm） |
额定功率/Rated Power |
950W |
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3.图像识别系统/Image Recognition System |
耗气量/Gas Consumption |
5L/min |
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灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
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分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/Length x Width x Height |
170×100×180cm |
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图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
1200kg |