HAD300A-R, HAD300A-L
Triple-head Plane-type High-speed Die Bonder
Single Head Cycle: 170ms
It is compatible with SMD020、1010、 2121、3014、2835 and 5050 etc.
Product Features
1. International leading triple die bond, triple adhesive dispensing and triple die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature double adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system is applied to saving the time of reloading;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;
10. GS300A-R is right loading and left unloading, the GS300A-L is left loading and right unloading.
Specifications and Parameters
1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
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生产周期/Production Cycle |
170ms(取决于晶片尺寸及支架(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
360°可旋转固晶 (Rotatable Die Bond) |
XY位置精度/Accuracy |
±1.0mil(±0.025mm) |
吸晶压力/Die Bond Pressure |
可调20g—250g(Adjustable) |
芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
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2.芯片XY工作台/Die XY Workbench |
行程范围/Range of Stroke |
170mm*75mm |
|
芯片尺寸/Die Dimensions |
5mil×5mil-80mil×80mil |
XY分辨率/XY Resolution |
0.02mil(0.5μm) |
6.适用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正/Max. Angle Correction |
±30° |
支架长度/Length |
80-170mm |
最大芯片环尺寸/Max. Die Ring Size |
6″(152mm)外径(External Diameter) |
支架宽度/Width |
45-75mm |
最大芯片面积尺寸/Max. Die Area |
4.7″(119mm)扩张后(Expanded) |
7.所需设施/Facilities Needed |
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分辨率/Resolution Ratio |
0.04mil (1μm) |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
顶针Z高度行程/Thimble Z Height
Stroke |
80mil(2mm) |
压缩空气/Compressed Air |
0.5MPa(MIN) |
额定功率/Rated Power |
1300W |
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3.图像识别系统/Image Recognition System |
耗气量/Gas Consumption |
5L/min |
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灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
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分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/Length x Width x Height |
249×93×195cm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
1700kg |
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