公司理念:创新、高效、和谐、务实
|
|
|
|
|
|
|

0755-27502933 

产品服务
PRODUCT  service
 
产品分类
HAD205-PDCO支架刷胶机
    发布时间: 2019-06-30 16:55    

HAD205-P(支架刷胶机)

(周期:20s

适用于SMA,SMB,SMC,SMAF矩阵式多排支架产品等。

一、机型特性

刷胶工艺对胶量一致性/焊层控制较点胶和沾胶有明显的优越性

坚固厚重的机构/网板座的可微调整设计,保证平台和网板的相对水平

数据处理能力:;

1,锡膏点位置/大小实时检测表格显示,位置/大小超出上下限报警停机

2,锡膏点位置/大小数据保存可追踪查询;

3,锡膏点位置/大小数据统计功能, ;

4,锡膏点位置/大小数据检测结果生成mappingdie attaching使用。

HAD205-P

Screen Printing Machine

Cycle: 20 s

It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

Product Features

To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

Data processing capabilities:

1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

2.      Solder paste mark position/ size data preservation for querying anytime;

3.      Solder paste mark position/ size data statistics function.;

4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

二、规格参数

Specifications and Parameters

1.系统功能/System Function

生产周期/Production Cycle

20 s

胶点精度/Accuracy

±2mil(±50um)

胶点大小/ Area

 ≦直径10% (胶点> 0.80 mm);≦直径15% (胶点< 0.8 mm)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

500W

耗气量/Gas Consumption

40L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

139×85×180cm

重量/Weight

800kg

6.图像识别系统/Image Recognition System

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

2560×1920像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

HAD205-D(平面式双头高速固晶机)

(周期:120ms

适用于SMA,SMB,SMC,SMAF矩阵式多排支架产品等。

一、机型特性

1.采用国际领先的双固晶,双芯片搜寻系统;

2.采用直驱电机驱动邦头

3.采用线性电机驱动搜寻芯片平台(X/Y)与送料平台(B/C

4. 晶框采用自动角度修正系统;

5.采用真空漏晶检测;

6. 采用自动式上下晶环、自动接驳台结构,有效提高了生产效率;

7. 工控机控制设备运行,简化了自动化设备的操作;

8.精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

9. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障

HAD205-D

Plane-type High-speed Die Bonder

Cycle: 120ms

It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip that alignment system is applied on the Crystal frame;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

120ms(取决于芯片尺寸及支架密集度)(Depending On Die Size And support load bearing capacity)

吸晶摆臂/

Swing Arm of Die Bonder

双邦双臂 (Rotatable Die Bond with Double Swing Arms)

XY位置精度/Accuracy (带芯片校正功能/ With Die Correcting Feature)

±1.5mil(±38um)

吸晶压力/

Die Bond Pressure

可调30g—300g(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/

Range of Stroke

100mm*300mm

芯片尺寸/

Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2.0mm*2.0mm)

XY分辨率/

XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

芯片最大角度修正/Max. Angle Correction

±180°

支架长度/Length

150mm ~ 300mm

最大芯片环尺寸/

Max. Die Ring Size

6″与7″可选(Optional)

支架宽度/Width

50mm~ 100mm

最大芯片面积尺寸/Max. Die Area

4″(101mm)、5127mm

7.所需设施/Facilities Needed

分辨率/

Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/

Compressed Air

0.5MPaMIN

额定功率/Rated Power

1000W

3.图像识别系统/Image Recognition System

耗气量/

Gas Consumption

40L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

192×85×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1250kg

HAD205-C(全自动裁切机)

(周期:90ms&取决客户支架与跳线料带的分布及生产线综合效率)

适用于SMA,SMB,SMC,SMAF矩阵式多排跳线料带产品等

一、机型特性

1Die dispensing

稳固的机构设计;点胶模组可扩展性适应客户支架;高达4组点胶针头,大大提高了点胶效率,每组点胶机构X/Y/Z向可调整方便调试维护;

2Clip attaching

高精密度冲切模具可保证切口毛刺小于0.05mm;刀具寿命可达1kk次;clip bond force参数化设定可保证芯片不受损

数据处理能力:

a,点胶点和Clip安装点位置/大小实时检测表格显示,位置/大小超出上下限报警停机

b,点胶点和Clip安装点位置/大小数据保存可追踪查询

c,点胶点和Clip安装点位置/大小数据统计功能

d,点胶点和Clip安装点位置/大小数据检测结果生成mappingdie attaching使用

HAD205-C

Clip and Cutting Machine

Cycle: 90ms

It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

Product Features

1.      Die Dispensing

Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

2, Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 1kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

c, Dispensing mark and clip mounting mark position/ size data statistics function;

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

二、规格参数

Specifications and Parameters

1.系统功能/System Function

生产周期/Production Cycle

90ms(取决客户支架与跳线料带的分布及生产线综合效率)

胶点精度/Accuracy

±2mil(±50um)角度±3°(炉前)

胶点大小/ Area

 ≦直径10% (胶点> 0.80 mm);≦直径15% (胶点< 0.8 mm)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1000W

耗气量/Gas Consumption

40L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

150×95×180cm

重量/Weight

1000kg

6.图像识别系统/Image Recognition System

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

656×492 & 2560×1920像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

HAD205-O(全自动接触式烤炉)

(周期:15-30s

适用于SMA,SMB,SMC,SMAF矩阵式多排支架产品等。

一、机型特性

1.产能 = 10~30 Sec. / 每一片(按锡膏商建议的Profile)

2.低耗电(升温时26KW/保温时2KW);低耗气(100/)

3.无氧化焊接 ,含氧量100ppm以下

4.同一温区 温差小于10?C ,可程序化之温度曲线设定

5.实时温度监控

6.不卡料之料片传送机构

二、优越性:

1.油烟处理 : 静电式油烟收集方式,回流焊接时产生之废气经处理后可直排室内

2.炉内腔体清洁保养周期 : 依锡膏品质/成份不同而异,如indium免清洗锡膏可一周清洁一次炉内腔体

3.自动profile功能:系统可自动产生炉温曲线,并可保存查询

4.炉盖加热:炉盖备有加热功能,保证焊油不在炉盖上凝聚

5.加热棒:选用高品质加热棒,保证同一温区各点实测最高温减最低温小于或等于10

HAD205-O

Reflow Oven

Cycle: 15-30s

It is compatible with SMA,SMB,SMC,SMAF matrix multi-row bracket products .

Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 100ppm

4. The temperature difference is less than10 ?C in the same temperature zone, Programmable temperature curve setting

5. Instant temperature monitoring

6. Unloaded web transfer mechanism

Superiority

1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 10.

三、规格参数:

Specifications and Parameters

1.系统功能/System Function

生产周期/Production Cycle

15-30s

氣泡率/Bubble rate

氣泡率≦10%(锡膏/支架表面/芯片背层良好情况下),

单颗气泡率<3%,总的气泡率<10%

炉后芯片位置/Accuracy

±0.075mm,角度±5°

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

380V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

6500W

耗气量/Gas Consumption

40L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

210×120×175cm

重量/Weight

1200kg

6.温度/Temperature

范围/Range

0400

7.水流量及水温/Water Flow and Temperature

水流量/Water Flow

5L / Min

水温/Water Temperature

15~20?C

8.适用气体 Suitable Gas

N2 only    100 L/min

快速通道
联系威尼斯官方网站
产品服务
行业应用
新闻资讯
XML 地图 | Sitemap 地图