HAD8606-H（六头平面式高速固晶机）

（单头周期：135ms）

适用于Mini LED PCB

一、机型特性

1.采用国际领先的六邦头固晶，六个晶片搜寻系统；三个固晶平台内部直接连线，同一基板同时一次性完成三种芯片固晶；

2.采用直驱伺服电机驱动邦头；

3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）；

4.夹具平台底部采用吸真空方式，PCB在真空的作用下达到固晶平面高度一致，提高固晶速度及固晶质量；

5.采用真空漏晶检测；

6.采用自动式上下料，两种方式兼容进料（料盒进料，接驳台进料），以及料盒收料和接驳台接下一台设备两种方式兼容收料，很大程度提高了生产效率；

7.芯片平台增加自动换环功能，可以自动修正芯片角度；

8.工控机控制设备运行，简化了自动化设备的操作；

9.精准的设备化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；

10. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。

HAD8606-H

Sextuple-head Plane-type High-speed Die Bonder

Single-head Cycle: 135ms

It is compatible with Mini LED PCB

Product Features

1.      International leading sextuple die bond, sextuple adhesive dispense and double die searching system; direct-wiring inside three die bond platforms, bonding three kinds of dies all at once on the substrate;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Vacuum picking method is adopted on the clamp base, uniformizing the bonding height of PCB to expedite the bonding and ensure the bonding quality simultaneously;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system, two ways of loading(by magazine or conveyor ) and receiving by magazine or the conveyor which connected to another machine, improving the production efficiency largely;

7.      Adding automatic ring changing function on the die platform, correcting the die theta automatically;

8.      IPC will control the operation of equipment, simplifying the usage of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters