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HAD205-P
Screen Printing Machine
Cycle: 60ms
It is compatible with SMD optocoupler etc.
Product Features
To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way
Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil
Data processing capabilities:
1. Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;
2. Solder paste mark position/ size data preservation for querying anytime;
3. Solder paste mark position/ size data statistics function, such as cpk.;
4. Solder paste mark position/ size data detection results generate mapping for die attaching.
Specifications
and Parameters
1.系统功能/System Function
生产周期/Production Cycle
60ms（取决于晶片尺寸及支架）(Depending On Die Size And
Holder)
（25-30s/ 1pcs 支架/holder）
2.送料工作平台/Loading Workbench
行程范围/Range of Stroke
100mm*300mm
3.适用支架尺寸/Suitable Holder’s Size
支架长度/Length
150mm~ 300mm
支架宽度/Width
50mm~ 100mm
4.所需设施/Facilities Needed
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
压缩空气/Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
500W
耗气量/Gas Consumption
5L/min
5.体积及重量/Volume and Weight
长x宽x高/Length x Width x
Height
139×85×180cm
重量/Weight
800kg
6.图像识别系统/Image Recognition System
灰阶度/Grey Scale
256级灰度(Level Grey)
分辨率/Resolution
656×492像素(Pixels)
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
HAD205-D
Plane-type High-speed Die Bonder
Cycle: 60ms
It is compatible with solder paste printed SMD
optocoupler etc.
Product
Features
1. International leading double die bond and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Vacuum die missing testing technology is adopted;
6. Automatic up & down crystal rings and
automatic inspection conveyor system is applied to improve the production
efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of
automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production
efficiency and reduce relevant costs so as to provide effective guarantee and
enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the
back-end processing.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand
system
生产周期/Production Cycle
60ms（取决于晶片尺寸及支架）(Depending On Die
Size And Holder)
吸晶摆臂/
Swing Arm of Die
Bonder
双摆臂126°可旋转固晶(Rotatable Die Bond with Double
Swing Arms)
XY位置精度/Accuracy (带芯片校正功能/ With Die
Correcting Feature)
±1mil(±0.025mm）
吸晶压力/
Die Bond Pressure
可调20g—250g(Adjustable)
芯片旋转/Die Rotation
±1°
5.送料工作平台/Loading
Workbench
2.芯片XY工作台/Die XY Workbench
行程范围/
Range of Stroke
100mm*300mm
芯片尺寸/
Die Dimensions
5mil×5mil-80mil×80mil
XY分辨率/
XY Resolution
0.02mil（0.5μm）
6.适用支架尺寸/Suitable
Holder’s Size
晶片最大角度修正/Max. Angle Correction
360°
支架长度/Length
150mm ~ 300mm
最大芯片环尺寸/
Max. Die Ring Size
6″与7″可选(Optional)
支架宽度/Width
50mm~ 100mm
最大芯片面积尺寸/Max. Die Area
4″（101mm）、5″（127mm）
7.所需设施/Facilities
Needed
分辨率/
Resolution Ratio
0.04mil (1μm)
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
顶针Z高度行程/Thimble Z Height Stroke
80mil（2mm）
压缩空气/
Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
1000W
3.图像识别系统/Image
Recognition System
耗气量/
Gas Consumption
5L/min
灰阶度/Grey Scale
256级灰度(Level Grey)
8.体积及重量/Volume
and Weight
分辨率/Resolution
656×492像素(Pixels)
长x宽x高/
Length x Width x
Height
192×85×180cm
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
重量/Weight
1250kg
(0.13mm*0.13mm-2.0mm*2.0mm)
HAD205-C
Clip and Cutting Machine
Cycle: 60ms
It is compatible with solder paste printed SMD
optocoupler etc.
Product
Features
1. Die Dispensing
Stable mechanism design; Dispensing module can
adapt to your holder; there are up to 4 sets of dispensing needles, which improved
the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z
direction are adjustable which facilitates debugging and maintenance;
2, Clip Attaching
The cutting burr is less than 0.05mm with the high-precision
die-cutting mold; the tool life can reach to 2kk times; the clip bond force
parameterization can protect the chip from damage.
Data
processing capabilities:
a, Real time detection table display of the dispensing mark
and clip mounting mark position/ size, auto-shutdown alarming system if
position/size exceeds the upper or lower limits;
b, Dispensing mark and clip mounting mark
position/ size data preservation for querying anytime;
c, Dispensing mark and clip mounting mark
position/ size data statistics function, such as cpk.;
d, Dispensing mark and clip mounting mark
position/ size data detection results generate mapping for die attaching.
Specifications
and Parameters
1.系统功能/System Function
生产周期/Production Cycle
60ms（取决于晶片尺寸及支架）(Depending On Die Size And
Holder)
2.送料工作平台/Loading Workbench
行程范围/Range of Stroke
100mm*300mm
3.适用支架尺寸/Suitable Holder’s Size
支架长度/Length
150mm ~ 300mm
支架宽度/Width
50mm~ 100mm
4.所需设施/Facilities Needed
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
压缩空气/Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
1000W
耗气量/Gas Consumption
5L/min
5.体积及重量/Volume and Weight
长x宽x高/Length x Width x
Height
150×95×180cm
重量/Weight
1000kg
6.图像识别系统/Image Recognition System
灰阶度/Grey Scale
256级灰度(Level Grey)
分辨率/Resolution
656×492像素(Pixels)
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
HAD205-O
Reflow Oven
Cycle: 60ms
It is compatible with solder
paste printed SMD optocoupler etc.
Product Features
1. Capacity is 10~30 Sec. per
piece (as recommended Profile by solder paste)
2. Low power consumption
(26KW when warming up/2KW when keep warming); low gas consumption (100
liters/min)
3. No oxidation welding
(nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm
4. The temperature difference
is less than 5 ?C in the same temperature zone
5. Programmable temperature
curve setting
6. Instant temperature
monitoring
7. Unloaded web transfer
mechanism
Superiority
1. Lampblack treatment:
Electrostatic lampblack collection, the exhaust gas generated during reflow soldering
can be directly discharged indoors after being treated;
2. The cycle of furnace
cavity cleaning and maintenance: Depending on the quality/component of the
solder paste, such as indium no-clean solder paste which needs to clean the
inner cavity once a week;
3. Automatic profile
function: the system can generate the furnace temperature curve automatically and
preserve the data for querying anytime;
4. Furnace cover heating: The
furnace cover is equipped with heating function to preserve the welding oil
from condense on the furnace cover.
5. Heating rod: the
high-quality heating rod is adopted which can ensure that the actual
measurement of the highest temperature minus the lowest temperature in each
temperature zone is less than or equal to 5℃.
Specifications
and Parameters
1.系统功能/System Function
生产周期/Production Cycle
60ms（取决于晶片尺寸及支架）(Depending
On Die Size And Holder)
2.送料工作平台/Loading
Workbench
行程范围/Range of Stroke
100mm*300mm
3.适用支架尺寸/Suitable
Holder’s Size
支架长度/Length
150mm ~ 300mm
支架宽度/Width
50mm~ 100mm
4.所需设施/Facilities
Needed
电压/频率/Voltage/Frequency
380V AC±5%/50HZ
压缩空气/Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
32000W
耗气量/Gas Consumption
5L/min
5.体积及重量/Volume and
Weight
长x宽x高/Length x Width x Height
210×120×150cm
重量/Weight
1200kg
6.温度/Temperature
范围/Range
0～400℃
7.水流量及水温/Water Flow and Temperature
水流量/Water Flow
5L / Min
水溫/Water Temperature
15~20?C
8.适用气体 Suitable Gas
N2/H2=93%/7% or N2 only
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