公司理念:创新、高效、和谐、务实
|
|
|
|
|
|
|

0755-27502933 

产品服务
PRODUCT  service
 
产品分类
HAD812全自动半导体平面式高速固晶机
    发布时间: 2020-09-09 18:18    

HAD812全自动半导体平面式高速固晶机)

(周期: 250ms

适用于IC类框架

一、机型特性

1.  直线电机驱动的双点胶系统;

2.  高精度直线驱动固晶绑头,音圈扭力环精确控制固晶压力;

3.  高精度搜寻芯片平台,伺服电机驱动芯片角度矫正系统,配备12寸晶圆自动扩膜系统;

4.  采用点胶独立控制系统,胶量控制更加精确;

5.  采用真空漏晶检测;

6.  工控机控制设备运行,简化了自动化设备的操作;

7.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;


HAD812

Automatic Plane-type Die Bonder

Cycle: 250ms

It is compatible with IC frame

1.        Linear motor is applied to drive double dispensing system.

2.        High precision linear motor drive die bonder, voice coil torsion loop controls die bond pressure accurately.

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with 12-inch wafer automatic film expansion system.

4.        A separate dispensing control system is adopted to make a precise control of dispensing amount.

5.        Vacuum die missing testing technology is adopted.

6.        IPC control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.



二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶邦头机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

250ms(取决于晶片与框架)(Depending On Die Size And Holder)

直线旋转邦头

/Die Bonder

直线电机往复固晶,邦头旋转/linear motor reciprocate die bonding

固晶精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调30g—300g(Adjustable)

晶片旋转/Die Rotation

±3°

5.适用支架尺寸/Suitable Holder’s Size

2.晶片XY工作台/Die XY Workbench

支架长度/Length

110mm ~ 300mm

晶片尺寸/Die Dimensions

15mil×15mil-100mil×100mil
(0.38mm*0.38mm-2.54mm*2.54mm)

支架宽度/Width

25mm ~ 110mm

晶片最大角度修正/

Max. Angle Correction

±180°

6.所需设施/Facilities Needed

适用晶片铁环尺寸/

Max. Die Ring Size

外径(External Diameter):400mm   内径(Inner Diameter)350mm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

最大晶圆面积尺寸

/Max. Die Area

12(Expanded)

压缩空气/Compressed Air

0.5MPaMIN

分辨率/Resolution Ratio

0.04mil  (1μm)

额定功率/Rated Power

1820W

顶针Z高度行程/Thimble Z Height Stroke

120mil3mm

耗气量/Gas Consumption

40L/min

适用铁环/晶圆

Suitable Iron ring/ wafer

标配 14寸铁环(12寸或10寸晶圆)

/Standard Equipped with 14Iron Ring 12 and  10″)Wafer

可兼容 10寸铁环(8寸晶圆)

/Compatible with 10Iron Ring 8Wafer

3.图像识别系统/Image Recognition System

适用针筒规格

Suitable Barrel Spec.

标配10CC(可兼容5CC3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC)

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

220×137×190cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

2000kg

快速通道
联系威尼斯官方网站
产品服务
行业应用
新闻资讯
XML 地图 | Sitemap 地图