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HAD816-A全自动高速固晶机
    发布时间: 2020-09-09 18:22    

HAD816-A(全自动高速固晶机)

(周期: 120ms

适合于矩阵式沾胶工艺的IC支架,如DFN/QFN系列、SOP系列


一、机型特性

1.采用国际领先的单邦双臂固晶,可程式恒温双沾胶,晶片搜寻系统;

2.自主研发视觉系统&工控机控制系统,简化了自动化设备的操作,简单易操作&维护;

3.材料/产品的自动载入载出,叠料方式吸支架上料具备吸纸功能,料盒载出,有效提高了生产效率;

4.采用丝杆伺服驱动搜寻晶片平台(X/Y)与线性电机驱动送料平台(B/C);

5.采用晶框自动校正晶片结构以及自动扩蓝膜结构,兼容8寸和6寸晶圆;

6.单邦双臂固晶bondforce参数化调整,流量式芯片真空检漏晶测,稳定可靠;

7.可程式恒温双沾胶模组,效率大幅提升,胶点精度和一致性高;

8.固晶位置精准及优良的一致性,高品质产品的保证;

9.节拍:120毫秒/点,实际产出取决于芯片尺寸和支架上产品的密集度;

10.进收料采用外挂模式,可多台设备联机生产。

HAD816-AAutomatic High-speed Die Bonder

Cycle: 120ms

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.


Model Features

1. International leading single die bonder and double swing arms, with programmable constant temperature double adhesive, and chip searching system.

2. Independently developed visual system & industrial computer control system, simplifying the operation of automatic equipment, easy to operate & maintain.

3. Automatic loading and unloading of materials/products, the loading of stacking material suction leadframe has the function of paper suction, and magazine unloading, effectively improving the production efficiency.

4. Screw servo drive is adopted to drive chip searching platform (X/Y) and linear motor is adopted to drive feeding platform (B/C).

5. Automatic frame-correcting wafer structure and automatic blue-expanding membrane structure, compatible with 8-inch and 6-inch wafers.

6. Single die bonder and double swing arms, bondforce parameter adjustment, flow-type chip vacuum leaking detection crystal measurement, stable and reliable.

7. Programmable constant temperature double adhesive module, greatly improving efficiency, glue point accuracy and consistency.

8. Precise location and good consistency of die bonding, guarantee of high quality.

9. Beat: 120 ms/point. Actual output depends on chip size and the density of products on the leadframe.

10. The material incoming and receiving adopt plug-in mode, and multiple equipments can be operated online.



二、规格参数/Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system

生产周期

/Production Cycle

120ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

180°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调20g-250g

(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围

/Range of Stroke

300mm*100mm

芯片尺寸

/Die Dimensions

5mil×5mil-90mil×90mil
(0.13mm*0.13mm-2.3mm*2.3mm)

XY分辨率

/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

360°

支架长度/Length

150mm~ 300mm

最大芯片环尺寸/Max. Die Ring Size

10″(254mm)外径  铁环(External Diameter) Iron Ring

支架宽度/Width

50mm~ 100mm

最大芯片面积尺寸/Max. Die Area

8″(210mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率

/Resolution Ratio

1μm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程

/Thimble Z Height Stroke

160mil4mm

压缩空气

/Compressed Air

0.5MPaMIN

额定功率/Rated Power

930W

3.图像识别系统/Image Recognition System

耗气量

/Gas Consumption

40L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656X492像素(Pixels)

xx/Length x Width x Height

220X120X155(不含显示器)cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围

(Observation Range)

重量/Weight

1300kg

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