HAD203(平面式高速固晶机)
(周期:65ms)
适用于印刷锡膏后的贴片二极管、三极管、光耦、手机背光源等
一、机型特性
1.采用国际领先的双固晶,双晶片搜寻系统;
2.采用直驱电机驱动邦头;
3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C);
4. 晶框采用自动角度修正系统;
5.采用真空漏晶检测;
6. 采用自动上下料系统,减少换料时间;
7. 采用自动装卸晶环系统,有效提高了生产效率;
8. 工控机控制设备运行,简化了自动化设备的操作;
9.精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;
10. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。
HAD203
Cycle: 65ms
Plane-type High-speed Die Bonder
It is compatible with solder paste printed SMD diode、audion、optocoupler tube and mobile-phone backlight etc.
Product Features
1. International leading double die bond and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Crystal frame automatic correction chip structure is also applied
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system is applied to saving the time of reloading;
7. Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;
8. IPC will control the operation of equipment, simplifying the operation of automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
二、规格参数
Specifications and Parameters
1.系统功能/System Function |
4.图像识别系统/Image Recognition System |
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生产周期/Production Cycle |
145ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder) |
灰阶度/Grey Scale |
256级灰度(Level Grey) |
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芯片尺寸/Die Dimensions |
5mil×5mil-80mil×80mil |
分辨率/Resolution |
512x512像素(Pixel) |
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通用垂直引线框架尺寸/General Vertical Lead Framework Dimensions |
长/L |
150mm-230mm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
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高/T |
19mm-40mm (可根据特殊尺寸设计) (Customizable) |
5.系统精准度/ System Accuracy |
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XY位置精度/Accuracy |
±1.5mil(±0.038mm) |
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芯片旋转/Die Rotation |
±3° |
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厚/H |
0.3mm-0.6mm |
6.焊头/Welding head |
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莭距/Pitch |
4.5mm-15.5mm |
吸晶摆臂/Swing Arm of Die Bonder |
90°旋转焊臂(Rotatable Welding Arm) |
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最多可容纳物料/Materials Held at Most |
4K-5K |
吸晶压力/Die Bond Pressure |
可调20g -250g(Adjustable) |
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2. 芯片处理器/Die Processor |
7.所需设施/Facilities Needed |
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最大芯片环尺寸/Max. Die Ring Size |
6.5″(165mm)外径(External Diameter) |
电压/频率Voltage/Frequency |
220V AC ±5% / 50HZ |
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压缩空气/Compressed Air |
0.5MPa(MIN) |
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最大芯片面积尺寸/Max. Die Area |
4.7″(119mm)扩张后(Expanded) |
额定功率/Rated Power |
700W |
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3.芯片工作台/Die XY Workbench |
耗气量/Gas Consumption |
5L/min |
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8.体积及重量/Volume and Weight |
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分辨率/Resolution Ratio |
0.04mil(1μm) |
长x宽x高/ Length x Width x Height |
90x95x180cm |
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顶针Z高度行程/Thimble Z Height Stroke |
80mil(2mm) |
重量/Weight |
515kg |
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